86exporter.com Home       Products Catalog      Suppliers Catalog      Log In        Sign up
      About Us
      Profile
      Products
      Contact Us


Bolanshuoke Technology Development Co., Ltd.

Products >> Room Temperature Curing of Epoxy Resin

Room Temperature Curing of  Epoxy Resin

Build Your Online Product Catalogs?



Description
Product Name: Room Temperature Curing of Epoxy Resin
Supply Ability:
Related proudcts epoxy resin, wettability,
Specifications DSC 6815A
Price Term:
Port of loading:
Minimum Order
Unit Price:

This resin system has good wettability, medium curing activity and moderate viscosity. Molded product, with excellent mechanical properties and high toughness, good corrosion resistance, it’s overall performance reached and exceeded similar imported epoxy resin, is suitable for hand lay-up, vacuum infusion, resin transfer molding and other processes. Widely used in the manufacture of high-grade auto parts, megawatt-class wind turbine blades (38 m -62 m), aero***ce parts and military and civil ships, composite mold and other fields.
I. Resin system
DSC 815A resin
Resin viscosity (25 â„?: 1300***s
Density: 1.13-1.16g / cm3
Flash Point: 230 â„? DSCW6815B curing agent
Viscosity (25 â„?: 19***s
Density: 0.9-1.0g / cm3
Flash Point:> 200 â„? II. Mixing Characteristics
Weight ratio: DSCW6815A Epoxy resin: DSCW6815B Curing agent: = 100: 30
Gel time min (25 â„? 90
Glass transition temperature (â„? 80

III. Mechanical properties:
Curing system: room temperature curing, post-processing at 50 â„?for 3 hours
1. Casting body performance:
Tensile properties (ISO 527-2)
Tensile strength: �3***
Tensile modulus: �.9GPa
Tensile Strain at break: �.0%
Bending properties (ISO 178)
Flexural modulus: �.9GPa
Bending strength: �05***
2. Composites properties (glass fiber uniaxial UD1200)
0 ° tensile properties (ISO 527-5)
Tensile strength: �30***
Tensile modulus: �4Gpa
0 ° compression performance (ISO 14126)
Compressive strength: �30***
Compression modulus: �2Gpa
Operation Information
1. Before mixing
Remove dirt, grease and moisture on the mold surface
2. Mixing
The resin and hardener should be mixed pro rata for bubbles escape after standing 2-5 minutes, it can also operate in a vacuum environment.
3. Curing process
Product is cured at room temperature 25 â„? and will be treated at 50 â„?3 after 3 hours.
Storage Conditions
HJ815 resin system, does not produce crystals in a sealed container with properly

Contact Us
Company: Bolanshuoke Technology Development Co., Ltd.
Contact: Mr. Rex Zeng
Address: Dongli District
Postcode:
Tel: 0086-022-86728451
Fax: 0086-022-86728452
E-mail:         


Copyright© Bolanshuoke Technology Development Co., Ltd. All Rights Reserved.
Tel : 0086-022-86728451 Fax : 0086-022-86728452
Powered by 86exporter.com